Objective of the MEMSland Project

The objective of the MEMSland project, as part of the Point One program, is to develop and integrate all key competencies and technologies needed for the development of a comprehensive MEMS packaging solution. Cooperation on a national scale will be needed to achieve cost effective options for new MEMS device creation. In addition, the project will enhance the education of highly qualified experts in this complex field. This will result in a sustainable innovation environment and world class competitive strength of the Netherlands in the emerging sensor/actuator/MEMS business.

 

An overview of the MEMSland activities can be found here: 2009 Overview of the MEMSland program for SenterNovem

Relevance

Market relevance integrated micro devices and Microsystems (sensor/actuator/MEMS) will in the near future enable the combination of a wide variety of functions (electrical, mechanical, optical, chemical, medical, biological and others) with unlimited potential of applications. Geometrically, these range in size from nanometers, micrometers to millimeters, with a capability of combining computation and data storage with many other non-digital functions, such as sensing, actuation and wireless communication. As the important building blocks of the so-called "More than Moore" domain (i.e. not scaling with "Moore’s Law") and the physical enabler for Ambient Intelligence, these devices will change the way in which we perceive and control the physical world with far reaching effects. It will create new industries and will impact both economy and society. Although R&D work on MEMS has been ongoing for several years now, it has received a new impetus, due to this "More than Moore" development. In this context, the following factors are important:
- There is an increased societal need for non-digital and heterogeneous function integration, such as offered by various MEMS technologies and devices;
- System-in-Package (SiP) solutions enable the integration of digital ("More Moore") and non-digital ("More than Moore") functionality in a single device. For the semiconductor industry, this is a tremendous opportunity to extend their product portfolio and manufacturing capabilities.
- The semiconductor industry has created a solid technology infrastructure, which is readily available for MEMS business;
- Numerous fundamental programs related to MEMS have been established in academia worldwide, and are available for industrialization;
- MEMS technology is moving from niche applications into volume markets.
In traditional integrated circuit manufacturing, the package is mostly conceived as a commodity, which provides electrical connectivity and protects the device from the environment. A MEMS package has much more functionality: it provides a window to the outside world, enabling the device to sense and react to the environment. Above the general requirements for advanced packaging, such as miniaturization, cost effective MEMS packaging is the key to the commercialization of various MEMS devices. This will have a direct influence on the performance and reliability, and will determine more 60 – 80 % costs and 90% of the size of the whole system.
An introduction for the MEMSland program can be found here.

 

Some Business Success Stories in MEMSland:

2006 Cavendish Kinetics raises 15.5 M USD

2008 Epcos opens new growth markets

2008 Financieel Dagblad C2V Gaschromatograaf in je Handpalm

2009 Trouw Anteryon: Nederlandse Lenzen veroveren de wereld

2009 SUSS MicroTec installs PhoeniX Software manufacturing execution system at MST.factory dortmund

2009 C2V Acquired by Thermo Fischer C2V is proud to announce that C2V has become part of Thermo Fischer.

 

March 2009: Minister van der Hoeven visits the MEMSland stand in the Evoluon (source: M. Nuijten SenterNovem)

 

MEMSland Publications Archive (read about the technical and business details of the business cases and demonstrators):

= <  2006

2007

2008

2009

2010

 

More information:

Overview if the MEMSland program (presentation for SenterNovem)
Background MEMSland (More than Moore, Heterogeneous integration)
Participants (NXP, TNO, Philips Apptech, Anteryon, MA3 Solutions, Lionix, Phoenix, Bruco, C2V)
Business Carriers (MEMS Oscillator, Micro Camera, RF MEMS, micro GC, pico Beamer, BAW filter, Optical Sensor)
Publications and Dissimination (Details about technical and business issues)
Links (Other interesting websites)

 

 

A closing MEMSland Symposium has been held Thursday 3 December 2009 at TNO Science and Industry in Eindhoven. More than 60 participants have attended this symposium. An overview of the presentations can be found here.  An article describing the symposium has been published in the Mikroniek (vol 50, no 01, 2010)

 

Program of the Symposium: MEMSland Symposium program.  MEMSland Symposium Presentations

 

 Version: 17 May 2010

Contact: info@memsland.nl